January 2008
Fujifilm Corporation outdid the competition in 2006 with its development of the “FAiRS-9000 Series,” a 45nm node*1 compatible ArF immersion photoresist that does not require topcoat (protective film) and offered samples of it in the same year. FUJIFILM now plans to introduce the latest “ArF immersion exposure tool” and further improves development aimed at the commencement of 45nm node mass production by large semiconductor manufacturers and thereby expand its cutting-edge ArF photoresist business.
FUJIFILM’s “FAiRS-9000 Series” is regarded by semiconductor manufacturers as the best for the next-generation semiconductor manufacturing process due to not only its lithography performance, but also its great reduction of pattern defects. FUJIFILM plans to leverage the “ArF immersion exposure tool” and move past the 45nm node to develop next-generation semiconductor photoresist of the best quality in the 32nm node as well.
The “ArF immersion exposure tool” is compatible with 45nm/32nm node ArF immersion lithography processes*2 and will be introduced by the Electronic Materials Research Laboratories (Yoshida-cho, Haibara-gun, Shizuoka) which is FUJIFILM’s research and development center for photoresist products. By introducing a “coater and developer” along with the “ArF immersion exposure tool,” FUJIFILM will enable consistent evaluation of ArF immersion photoresists and therefore be able to respond to the needs of the customer even quicker than before.
It is hoped that ArF immersion lithography technology will be adaptable to the forming of finer circuit patterns in 32nm node semiconductor devices through the application of the “double patterning process.”*3 FUJIFILM is enhancing its development of materials that will enable simple processes in generations to follow 32nm that cost less and are highly productive.
FUJIFILM has positioned semiconductor materials as a growth business and aims to capture a large share of the market.
It will continue with research and development that contributes to the further development of the semiconductor industry and provide customers with the highest quality next-generation immersion photoresist.
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